Memory Hardware Engineer

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Employer: Lenovo Japan, LLC

Work location: Minato-mirai (Yokohama-shi); (*3 onsite and 2 remote days in a week could be applicable)

Smoking: Not allowed in the office, but smoking room is available in 21st floor of Minato-mirai Center Building

Employment condition: Permanent Staff (Probation period: 6 months)

Expected salary: Depending on the current salary and experience, we would make our decision.

Discretionary labor system allowance: Applicable for Band 6 (50,000 JPY per a month)

Working hours: 9:00-17:45 (Rest time: 1 hour (12:00-13:00))

Holidays: Saturday, Sunday, national holidays, year-end holiday, established anniversary day, special holiday, and compensatory holiday

Social insurance and benefits: Comprised of Pension, Health, Unemployment and Worker's Accident Compensation, Defined-contribution pension, property accumulation savings, Lenovo employee group life insurance, etc.

■About Organization

• Report to : Director, Memory Power Technology
• Subordinates : None
• Number of Peers : 9
  
  

■Roles And Responsibilities

• Technical project management of Memory for ThinkPad
• Communication interface to suppliers and Lenovo internal cross functional teams for related projects’ technical issues of memory
• Creates test plan / report for memory qualification
• Directs/review supplier outsourcing vendor for qualification testing (approve/dispute results, etc.)
• Performs pre-qualification testing, design review, and critical qualification tests
• Directs defect analysis and problem resolution. Manage suppliers outsourcing vendors to resolve issues and review/approve fix plan
• Support Product Development to enable emerging memory technologies with technical expertise
• Report Qualification Status. Make an organized presentation for technical details.
  
  

■Key Interaction With

• Development teams in Lenovo/NECPC Japan, Lenovo China, Lenovo US
• System Development team (EE, ME, BIOS, SW)
• Product Assurance team (PAPM, HWPA, SWPA)
• Product Engineering team
• Strategic Technology Innovation Center
• Subsystem Development team
• Worldwide Lenovo operation team
• Memory Operations Team (GCM, GSM, SQE, Service)
• Offering Core Team (PBM, TPM, Marketing)
• Quality Team (PQE, MQE, PE, SQE)
• Product planning team
• Supplier Partners
• Memory suppliers (Samsung, SK Hynix, Micron, CXMT, Kingston, Ramaxel)
• CPU suppliers (Intel, AMD, Qualcomm, NV)
• ODM partners (LCFC, Wistron, etc)
• Outsourcing vendors
  
  

Requirements

Must Have – essential

• 3 years minimum experience in memory development especially qualifications or project management.
• Basic knowledge of memory, PC hardware, CPU, motherboard, Bios.
• Good project management skills
• Good oral and written English skills
• Ensure timely response and accurate communication
• Proactive in deep analysis improvement
• Strong interest in creation innovation
  
  

Good to have - desirable

• Better to speak in Chinese and Japanese
• Experience of memory design, testing, wafer manufacturing
• Experience of memory and motherboard failure analysis
• Experience of LLM, AIPC, memory signal testing, memory communication with XPU
• Failure analysis skills
• Organized English Presentation
• Good negotiation skill
  
  

Typical Candidate

• Memory development / qualification / testing engineer who ever worked in PC company, Device company for memory or ODM
  
  

We are an Equal Opportunity Employer and do not discriminate against any employee or applicant for employment because of race, color, sex, age, religion, sexual orientation, gender identity, national origin, status as a veteran, and basis of disability or any federal, state, or local protected class.