๐ Stamford, Connecticut
HARMAN designs and engineers connected products for automakers, consumers, and enterprises, headquartered in Stamford, Connecticut. Its product portfolio includes audio systems, connected car technologies, and software solutions for automotive applications, with notable brands like JBL and AKG enhancing user experiences across various markets. Engineering disciplines at HARMAN include embedded systems, software development, and hardware design, focusing on audio signal processing, wireless communication, and automotive integration. With a workforce of approximately 30,000 employees, HARMAN operates multiple engineering centers worldwide, enabling it to deliver advanced technologies that meet the demands of modern connectivity and entertainment.
Hardware Engineer -
@ HARMAN International
Principal Engineer - Embedded C, BSP Driver, Linux Kernel
@ HARMAN International
Intern - Embedded C
@ HARMAN International
Advance Engineer - Embedded Software Engineering
@ HARMAN International
Principal Hardware Engineer, Display
@ HARMAN International
Associate Engineer - Linux Kernel & Driver Development
@ HARMAN International
Global Brand Manager, Luxury & Embedded Audio
@ HARMAN International
Internship - Embedded
@ HARMAN International
Principal DevOps Engineer
@ HARMAN International
Advanced Engineer โ Embedded Machine Learning
@ HARMAN International
Hardware Electronics Engineer
@ HARMAN International
Advanced Engineer - Embedded C++ linux
@ HARMAN International
Software Engineer - Embedded Linux
@ HARMAN International
Advanced Engineer - Embedded C++ Linux
@ HARMAN International
Internship - Embedded C, Linux, Kernel Development
@ HARMAN International
Software Engineer, Embedded Software
@ HARMAN International
Director, Embedded Software
@ HARMAN International
Principal Hardware Engineer
@ HARMAN International
Associate Engineer, Embedded Software
@ HARMAN International
Associate - Embedded AI & Data Analytics Engineer
@ HARMAN International
Associate - Agentic AI - Embedded System
@ HARMAN International
Associate - Agentic AI - Embedded System
@ HARMAN International
Foundational Engineer, Embedded Software
@ HARMAN International
Hardware Engineer
@ HARMAN International
Software Engineer, Embedded Software
@ HARMAN International
Principal Hardware Engineer, Value Management
@ HARMAN International
Intern - Linux Kernel
@ HARMAN International
Software Engineer - Embedded C++
@ HARMAN International
Hardware Engineer -
@ HARMAN International
Advanced Engineer - Linux Kernel Driver Developer
@ HARMAN International
Software Engineer, Embedded
@ HARMAN International
Principal Systems Engineer - Embedded Audio
@ HARMAN International
Principal Embedded Linux SW Engineer
@ HARMAN International
Software Embedded Engineer - Linux Kernel/Device Driver, Bootloader
@ HARMAN International
Software Embedded Engineer - Linux Kernel/Device Driver, Bootloader
@ HARMAN International
Principal Embedded Linux SW Engineer
@ HARMAN International
Software Engineer, Embedded
@ HARMAN International
Intern - Embedded C
@ HARMAN International
Advance Engineer, Embedded Software
@ HARMAN International
Principal Engineer, DSP/ๅตๅ
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@ HARMAN International
Software Engineer, DSP & Python
@ HARMAN International
Software Engineer - Embedded C developer
@ HARMAN International
HW Engineer
@ HARMAN International
Hardware PCB Layout Engineer
@ HARMAN International
Advanced Engineer, DSP
@ HARMAN International
Software Engineer - Embedded Software Engineering
@ HARMAN International
Principal Engineer - DSP
@ HARMAN International
Software Engineer - DSP
@ HARMAN International
Advanced Engineer - DSP
@ HARMAN International
Advanced Engineer - Embedded Software Testing
@ HARMAN International
Embedded Linux SW Engineer
@ HARMAN International
Advanced Engineer, Embedded Software - Camera HAL
@ HARMAN International
Engineer, DSP/ๅตๅ ฅๅผ้ณ้ขๅทฅ็จๅธ
@ HARMAN International
Software Engineer, Embedded Software
@ HARMAN International
Intern - Embedded C
@ HARMAN International
Intern - Embedded Tester
@ HARMAN International
Software Engineer, Embedded Software
@ HARMAN International
Principal Engineer, DSP/ๅตๅ
ฅๅผ้ณ้ขๅทฅ็จๅธ
@ HARMAN International
Engineer, DSP/ๅตๅ ฅๅผ้ณ้ขๅทฅ็จๅธ
@ HARMAN International
Software Engineer - Yocto Integration
@ HARMAN International
Advanced Engineer - Embedded C++
@ HARMAN International
Software Engineer - Embedded
@ HARMAN International
Principal Engineer, DSP
@ HARMAN International
Principal Engineer,DSP
@ HARMAN International
Software Engineer - Embedded C++
@ HARMAN International
Advanced Engineer - DSP
@ HARMAN International
Software Engineer - NAD Embedded C
@ HARMAN International
Advanced Engineer - Embedded C++
@ HARMAN International
MATLAB Embedded Enginner
@ HARMAN International
Intern - Embedded C
@ HARMAN International
Software Engineer - DSP
@ HARMAN International
Advanced Engineer - Embedded Testing
@ HARMAN International
Advanced Engineer - Embedded C++
@ HARMAN International
Advanced Engineer - DSP
@ HARMAN International
Software Engineer - Embedded Applications
@ HARMAN International
Advanced Engineer - Embedded C++
@ HARMAN International
Software Engineer - Embedded C, Autosar MCAL
@ HARMAN International
Advanced Engineer - Embedded C++
@ HARMAN International
Embedded Engineer
@ HARMAN International
Software Engineer - Embedded Software Engineering
@ HARMAN International
Principal Engineer, Embedded Software Engineering
@ HARMAN International
Software Engineer - Embedded Linux
@ HARMAN International
Hardware PCB Design Engineer
@ HARMAN International
Software Engineer - Embedded C++
@ HARMAN International
Software Engineer - Linux Kernel
@ HARMAN International
Principal Engineer, DSP
@ HARMAN International
Advanced Engineer, DSP
@ HARMAN International
Staff Engineer, Embedded Software Engineering
@ HARMAN International
Advanced Engineer - Embedded Linux
@ HARMAN International
Softere Engineer - Embedded Linux
@ HARMAN International
Software Engineer - Embedded C++
@ HARMAN International
Advanced Engineer - Embedded C++
@ HARMAN International
Engineer II, Embedded SW - C++, Linux, Middleware
@ HARMAN International
Engineer II, SW - Embedded C++
@ HARMAN International
Engineer I, SW - Embedded C, Linux Developer
@ HARMAN International
Principal Embedded Software Engineer
@ HARMAN International
Principal Engineer I, DSP
@ HARMAN International
Principal Engineer โ Embedded Software
@ HARMAN International
Engineer, DSP
@ HARMAN International
Embedded Linux SW Engineer
@ HARMAN International
Software Engineering-Embedded Software Engineering
@ HARMAN International
Principal Engineer-Embedded Software Engineering
@ HARMAN International
Engineer, Embedded software / Firmware
@ HARMAN International
Embedded Software Engineer
@ HARMAN International
Android Firmware developer AOSP
@ HARMAN International
Principal Engineer, DSP
@ HARMAN International
Embedded Software Engineer โ BIOS
@ HARMAN International
Engineer I SW, DSP
@ HARMAN International
Engineer II - DSP
@ HARMAN International
Embedded Software engineer - Bluetooth
@ HARMAN International
Engineer, DSP
@ HARMAN International
Engineer, DSP
@ HARMAN International
Engineer II, SW - Embedded C++
@ HARMAN International
Android Firmware developer
@ HARMAN International
Principal Engineer, DSP
@ HARMAN International
Engineer I - Linux Embedded Developer
@ HARMAN International
Embedded Firmware Engineer MCU
@ HARMAN International
Engineer I, SW - Embedded C, Linux Developer
@ HARMAN International
Firmware Engineer
@ HARMAN International
Embedded C Developer
@ HARMAN International
Engineer, DSP
@ HARMAN International
Engineer, DSP
@ HARMAN International
Engineer - DSP
@ HARMAN International
Linux Kernel Engineer
@ HARMAN International
Principal Embedded Software Engineer (Firmware๏ผ
@ HARMAN International
RTOS Kernel Engineer
@ HARMAN International
Engineer II - Embedded C AUTOSAR
@ HARMAN International
Embedded Linux Engineer
@ HARMAN International
Principal Engineer, DSP
@ HARMAN International
Embedded C++ Engineer
@ HARMAN International
HW Wireless Engineer
@ HARMAN International
IC Design Engineer
@ HARMAN International
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HARMAN designs and engineers connected products for automakers, consumers, and enterprises, headquartered in Stamford, Connecticut. Its product portfolio includes audio systems, connected car technologies, and software solutions for automotive applications, with notable brands like JBL and AKG enhancing user experiences across various markets. Engineering disciplines at HARMAN include embedded systems, software development, and hardware design, focusing on audio signal processing, wireless communication, and automotive integration. With a workforce of approximately 30,000 employees, HARMAN operates multiple engineering centers worldwide, enabling it to deliver advanced technologies that meet the demands of modern connectivity and entertainment.
HARMAN International currently has 7 active embedded systems positions spanning 4 countries. All positions are on-site, typical for hardware-focused roles requiring lab access and equipment. Recognized as a top-tier employer (85.0/100), HARMAN International offers competitive compensation and strong career development paths in embedded engineering.
* Data represents job posting activity over the past 6 months: Feb 2026 through Jul 2026
HARMAN International's hiring pace has moderated recently (5 openings this month vs 14 last month),
which is common after major hiring pushes or as projects move from development to deployment phases.
Over the past 6 months, HARMAN International averaged 10.0 job postings per month,
with peak hiring in Jun 2026 (14 openings).
For embedded systems roles, hiring activity typically correlates with product development cycles,
especially for firmware teams during pre-production phases and hardware engineers during prototyping.
๐ -64% change
Consistent hiring velocity
Jun 2026
C++ is the most in-demand skill at HARMAN International,
appearing in 53% of all job listings (past and present).
This skill is important but not universal, indicating diverse technical needs across different product lines or teams.
HARMAN International's technology stack spans 171 distinct skills and tools,
reflecting the multifaceted nature of embedded systems development.
The broad technical diversity (171 technologies) suggests work on complex,
multi-domain projects requiring both hardware and software expertise.
Engineers joining HARMAN International should combine depth in key areas with adaptability. The mix of hardware skills (PCB design, schematics) and firmware expertise (RTOS, embedded C) indicates full-stack embedded development where engineers work across the hardware-software boundary. Candidates with adjacent skills (version control, testing frameworks, communication protocols) typically advance faster by contributing across the development lifecycle.
HARMAN International's primary hiring focus is Embedded Systems Engineer with
3 open positions. High-volume recruitment for a single role type typically indicates
either a growing team building similar capabilities or a newly formed department scaling rapidly.
Multiple openings in the same discipline create advantages for new hires:
stronger peer support networks, established onboarding processes, and clearer career progression paths
as the team matures. Engineers often find collaborative environments more conducive to professional growth.
Experience level distribution: 43% of openings target senior-level engineers. The range across 5 experience levels suggests a well-balanced team structure with opportunities for both experienced engineers and those earlier in their careers.
HARMAN International operates across 7 countries with 18
total hiring locations. Multi-geography recruitment typically indicates either distributed engineering teams,
expansion into new markets, or proximity to manufacturing and customer operations.
Bengaluru, India serves as a primary hiring hub with 61% of all roles
(80 positions).
This concentration suggests Bengaluru hosts HARMAN International's
main engineering center, where core product development likely occurs.
These employers share technical focus areas with HARMAN International and are actively hiring embedded engineers. Exploring multiple companies helps candidates understand market compensation, compare technical challenges, and identify the best cultural and technical fit for their career goals.
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