Frontier of On-device AI Semiconductors
for Everyone, Everywhere
About DeepX Co., Ltd .
DEEPX is a forward-thinking Series D startup architecting the infrastructure for the Physical AI era.
By delivering the world’s most energy-efficient NPU technology, we are solving the critical power and heat challenges of Generative AI to bring super-intelligence to every device, everywhere.
Our global leadership is validated by our record-breaking recognition as a multi-year CES Innovation Award honoree (2024 & 2026) and being named the 2024 Frost & Sullivan Company of the Year in the NPU sector. With an enterprise value approaching 1 trillion KRW, DEEPX offers a unique pre-IPO
opportunity to join a market leader defining the new industry standard for the $70B AI semiconductor market.
We are currently scaling toward mass production of our flagship DX-M1 (Samsung 5nm) with over 50 global projects scheduled, while engineering next-generation 2nm solutions to support 100B parameter Large Language Models (LLM) at the edge. ☞ Link
★ If you want to be part of world-class innovation? Please talk with us.
★Explore our journey: The DEEPX White Paper ☞ Link
Responsibilities
□ SoC ASIC Design (Focused on AI Hardware Processor Design and Development)
Qualifications
□ RTL design using Verilog/SystemVerilog
□ SoC design using ARM Core, AMBA bus, and interconnect
□ Design of bus interfaces for AMBA architectures such as AXI
□ SoC top-level integration and verification
□ Experience with EDA tools for RTL simulation and synthesis
□ Proficient in Linux, shell scripting, Tcl, Python, and Perl
□ In-depth understanding and experience with Clock Domain Crossing (CDC)
Preferred Qualifications
□ Experience with RTL synthesis, Static Timing Analysis (STA), CDC checks, Lint, formal verification, and back-end design support
□ Design experience with system-level CDC-free Clock Generation Units (CGU) and Reset Generation Units (RGU)
□ Extensive experience with ECO (Engineering Change Order) processes
□ Hands-on experience with mass production and chip bring-up of ASIC, SoC, or Application Processors
□ Experience supporting FPGA prototyping
□ Experience with integration of PCIe, USB, and LPDDR/DDR 4/5
□ Knowledge of artificial neural networks and deep learning
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