Senior Specialized Hardware Engineer, AR Glasses

Google 

📍 New Taipei, Taiwan 🇹🇼

full-time
senior
Posted —

Key Skills

SoCMCUUSB-CI2CUART

Industry

Consumer ElectronicsAerospace

Job Description

Minimum qualifications:
  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
  • 4 years of experience in a consumer electronics environment.

Preferred qualifications:
  • Experience with: SOC/MCU selection, PMIC, integrating Camera, Display, Sensor and Eye Tracking systems.
  • Experience with board design, schematics capture tools, signal integrity and layout review.
  • Strong EE fundamentals, ability to design SoC or MCU based designs for constrained form factors like AR glasses.
  • Proficiency in communication protocols (especially USB-C, SPI, I2C, UART, MIPI, DSI, CSI).
  • Prototype bring-up in house or onsite at a JDM partner, debugging, functional verification and manufacturing.
  • Debugging and mitigating EMI and ESD problems and design for manufacturability and Scaling.
About the job:
For decades, the computing revolution has reshaped our world driven by
breakthroughs in compute, connectivity, mobile, and now, AI. Google's XR team is at the forefront of the next major leap – the convergence of AI and XR. This is more than just new devices – it's about reimagining how we interact with the world around us. We're building a future where
lightweight XR devices like smart glasses and headsets pair with helpful AI to augment human intelligence, offering personalized, conversational, and contextually aware experiences.

Responsibilities:
  • Gather system requirements from product management and cross-functional teams, define architecture, and execute hardware design for next generation AR glasses.
  • Execute hardware system development from initial concepts through schematics/PCB layout, bring up, debug and support high-volume production.
  • Lead debug and root cause analysis of complex hardware issues during bring up and scaling.
  • Collaborate cross-functionally with Hardware, Firmware, Software, Power, Mechanical, Thermal, Validation, Signal Integrity, Manufacturing, and external vendors to ensure system integration meeting quality and schedule.
  • Partner closely with firmware/software engineers to support the development and integration of firmware/software for SoC and embedded microcontrollers. Travel as needed to support bring-up at factories including but not limited to the ones in Taiwan and China.