As ASIC Physical Design Lead y
ou will be leading the design of IP/SoC in advanced process technologies, serving global Semiconductor product MNC clients.
Job Summary:
We are looking for an ASIC Physical Design Lead with extensive experience in timing closure and full-chip physical design. The candidate should be adept at interacting with the packaging team and managing tasks such as pads log, bump placement, and RDL routing.
Key Responsibilities:
-
Lead the physical design of complex ASIC projects from Netlist to GDSII.
-
Perform
timing closure
tasks including synthesis, place and route, and static timing analysis.
-
Oversee
full-chip physical design
processes, including floor planning, power grid design, clock tree synthesis, and signal integrity analysis.
-
Collaborate with the packaging team
to ensure seamless integration of the chip design with the package, including
pads log management
,
bump placement
, and
RDL routing
.
-
Mentor junior engineers and guide them on physical design methodologies.
-
Drive innovation and efficiency in physical design workflows.
Qualifications:
-
Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
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Minimum of 10 years of experience in ASIC physical design.
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Expertise in industry-standard EDA tools for physical design and verification.
-
Strong understanding of
timing closure
techniques and challenges.
-
Experience with
full-chip design
and familiarity with multi-voltage and multi-clock domain designs.
-
Excellent problem-solving and analytical skills.
-
Strong communication and leadership abilities.