SoC RTL DFT Engineer

BOS Semiconductors โ†—

๐Ÿ“ Gyeonggi, South Korea, South Korea ๐Ÿ‡ฐ๐Ÿ‡ท

full-time
mid-level
Posted โ€”

Key Skills

DFTSoCEagle-NEagle-AATE

Industry

SemiconductorAutomotive

Job Description

SoC ๋ฐ˜๋„์ฒด Package Design Engineer

์ž์œจ์ฃผํ–‰ ์ž๋™์ฐจ, ์–ด๋””๊นŒ์ง€ ์ƒ์ƒํ•ด ๋ณด์…จ๋‚˜์š”? ์šด์ „๋Œ€ ์—†๋Š” ์ž๋™์ฐจ. ์šด์ „์ž ์—†์ด ์•„์ด๋ฅผ ํ”ฝ์—…ํ•˜๊ณ  ๋ถ€๋ชจ๋‹˜์˜ ๊ฐ•๋ณ€ ๋“œ๋ผ์ด๋ธŒ๋ฅผ ๊ฐ€๋Šฅํ•˜๊ฒŒ ํ•˜๋Š” ์ž๋™์ฐจ.

์šฐ๋ฆฌ์˜ ์ฆ๊ฑฐ์šด ์ƒ์ƒ์ด ์ตœ์ƒ์˜ ํŽธ์•ˆํ•จ๊ณผ ํ–‰๋ณตํ•œ ์ˆœ๊ฐ„์ด ๋˜๋„๋ก ์„ธ๊ณ„์ˆ˜์ค€์˜ ์ „๋ฌธ๊ฐ€ ๊ทธ๋ฃน ใˆœ ๋ณด์Šค๋ฐ˜๋„์ฒด๊ฐ€ ๋ชจ๋นŒ๋ฆฌํ‹ฐ ํ˜์‹ ์„ ์„ ๋„ํ•˜๊ฒ ์Šต๋‹ˆ๋‹ค.

โ–ก ํšŒ์‚ฌ ์†Œ๊ฐœ

- ๋ณด์Šค๋ฐ˜๋„์ฒด(BOS Semiconductors)๋Š” ์ฐจ๋Ÿ‰์šฉ ์ž์œจ์ฃผํ–‰ ๋ฐ ์ธํฌํ…Œ์ธ๋จผํŠธ ์‹œ์Šคํ…œ์„ ์œ„ํ•œ

๊ณ ์„ฑ๋Šฅ ๋ฐ˜๋„์ฒด ๋ฐ AI ๊ฐ€์†๊ธฐ ๋ฐ˜๋„์ฒด๋ฅผ ๊ฐœ๋ฐœํ•˜๋Š” ํŒน๋ฆฌ์Šค ๊ธฐ์—…์œผ๋กœ, ์ž๋™์ฐจ๋ฅผ ์ฃผ์š” ํƒ€๊นƒ

์‹œ์žฅ์œผ๋กœ ํ•˜๋ฉฐ ๋™์ผํ•œ ์ œํ’ˆ ํ”Œ๋žซํผ์„ ๊ธฐ๋ฐ˜์œผ๋กœ ๋กœ๋ด‡ ๋“ฑ ๋‹ค๋ฅธ Physical AI ์‹œ์žฅ์œผ๋กœ์˜

ํ™•์žฅ์„ ์ถ”์ง„ํ•˜๊ณ  ์žˆ์Šต๋‹ˆ๋‹ค.


- ๋Œ€ํ‘œ ์ œํ’ˆ์ธ Eagle-N (AI ๊ฐ€์†๊ธฐ)๊ณผ Eagle-A (์ฐจ๋Ÿ‰์šฉ SoC)๋Š” ์นฉ๋ › ๊ธฐ๋ฐ˜ ํ™•์žฅ์„ฑ๊ณผ

์„ ๋‹จ ๊ณต์ • ๊ธฐ์ˆ ์„ ๋ฐ”ํƒ•์œผ๋กœ ์ฐจ์„ธ๋Œ€ ์ฐจ๋Ÿ‰ ์ „์žฅ ๋ฐ ์ง€๋Šฅํ˜• ์‹œ์Šคํ…œ์— ์ตœ์ ํ™”๋œ ์„ฑ๋Šฅ๊ณผ ์ „๋ ฅ

ํšจ์œจ์„ ์ œ๊ณตํ•ฉ๋‹ˆ๋‹ค.


- ์ฐฝ์—… 5๋…„์ฐจ์ธ ํ˜„์žฌ ์ž„์ง์› 300๋ช… ์ด์ƒ, ๋ฒ ํŠธ๋‚จ ์—ฐ๊ตฌ๊ฐœ๋ฐœ ๋ฒ•์ธ๊นŒ์ง€ ๋ณด์œ ํ•œ ๋น ๋ฅด๊ฒŒ ์„ฑ์žฅํ•˜๋Š”

Global Top ๊ธฐ์ˆ ๋ ฅ์„ ๋ณด์œ ํ•œ ํšŒ์‚ฌ๋“ค๊ณผ ๊ฒฝ์Ÿํ•˜๋ฉฐ ์˜๋ฏธ ์žˆ๋Š” ์„ฑ์žฅ์„ ๋ชฉํ‘œ๋กœ ํ•˜๊ณ  ์žˆ๋Š” ํšŒ์‚ฌ

๋ณด์Šค ๋ฐ˜๋„์ฒด์—์„œ ํ•จ๊ป˜ ์„ฑ์žฅํ•ด ๋‚˜๊ฐ€์‹ค ๋ถ„์„ ๋ชจ์ง‘ํ•˜๊ณ ์ž ํ•ฉ๋‹ˆ๋‹ค.


โ–ก ์กฐ์ง ๋ฐ ์—…๋ฌด ์†Œ๊ฐœ

- ๋ณด์Šค๋ฐ˜๋„์ฒด์˜ DFT(Design-for-Testability)ํŒŒํŠธ๋Š” Automotiveํ–ฅ SoC ์ œํ’ˆ์˜ ํšจ๊ณผ์ ์ธ ์–‘๋ถˆ๋Ÿ‰

์„ ๋ณ„ ํ…Œ์ŠคํŠธ์™€ ๊ณ ์‹ ๋ขฐ์„ฑ ๊ธฐ๋Šฅ ๊ตฌํ˜„์„ ์œ„ํ•œ on-chip HW ๊ตฌ์กฐ์˜ ์„ค๊ณ„์™€ ๊ฒ€์ฆ, ์ œํ’ˆ์˜ ์„ฑ๊ณต์ ์ธ

์–‘์‚ฐ์„ ์œ„ํ•œ DFT ํ…Œ์ŠคํŠธ ํŒจํ„ด ์…‹์—…, ์‹ค๋ฆฌ์ฝ˜ ๋””๋ฒ„๊น…๊ณผ ๋ถ„์„์„ ์ฃผ์š” ์—…๋ฌด๋กœ ํ•˜๊ณ  ์žˆ์Šต๋‹ˆ๋‹ค.


- ์—…๊ณ„ ์ตœ์‹ ์˜ logic scan compression, logic/memory BIST, boundary scan, in-system test ๊ธฐ๋Šฅ์„ ์ œํ’ˆ ์ŠคํŽ™์— ๋งž์ถ”์–ด ์ตœ์ ํ™”ํ•˜๋ฉฐ, IP/SoC ์„ค๊ณ„ํŒ€, Physical Implementation ํŒ€๊ณผ์˜ ๊ธด๋ฐ€ํ•œ ํ˜‘๋ ฅ์„ ํ†ตํ•˜์—ฌ ISO 26262 ํ‘œ์ค€ ์š”๊ฑด์„ ์ถฉ์กฑํ•˜๋Š” ์—…๋ฌด ์™„๊ฒฐ์„ฑ๊ณผ coverage์˜ ๋‹ฌ์„ฑ์ด ํŒ€์˜ ๋ฏธ์…˜ ์ž…๋‹ˆ๋‹ค.


โ–ก ์ฃผ์š” ์—…๋ฌด

- Automotive SoC ๋‚ด๋ถ€ logic, embedded SRAM์„ ์œ„ํ•œ test, repair logic์˜ ์ƒ์„ฑ๊ณผ ์‚ฝ์ž…, ๊ฒ€์ฆ

- Test cost ๊ฐ์†Œ๋ฅผ ์œ„ํ•œ IP, block, full-chip DFT ๊ตฌ์กฐ ์ตœ์ ํ™”์™€ ๊ฒ€์ฆ

- Si. bring-up๊ณผ ์–‘์‚ฐ ATE ๋ฒกํ„ฐ ์ƒ์„ฑ๊ณผ ๊ฒ€์ฆ

- ๊ณ ์‹ ๋ขฐ์„ฑ ๊ธฐ๋Šฅ ๊ตฌํ˜„์„ ์œ„ํ•œ ํ…Œ์ŠคํŠธ H/W ๋กœ์ง ๊ฐœ๋ฐœ๊ณผ ๊ตฌํ˜„


โ–ก ํ•„์š” ์—ญ๋Ÿ‰

[๊ฒฝ๋ ฅ 5๋…„ ์ดํ•˜]

- ์ „๊ธฐ์ „์ž, ์ปดํ“จํ„ฐ ๊ด€๋ จ ์ „๊ณต ํ•™์‚ฌ ์ด์ƒ

- EDA tool (Synopsys, Siemens, Cadence) ๊ธฐ๋ฐ˜์˜ ASIC Front-End/DFT ๊ตฌํ˜„

- RTL2GDS flow์— ๋Œ€ํ•œ ์ „๋ฐ˜์ ์ธ ์ดํ•ด์™€ ์‹ค๋ฌด ๊ฒฝํ—˜

- Testability, Scan/MBIST/LBIST๋“ฑ์˜ DFT ๊ด€๋ จ ๊ธฐ์ˆ ์˜ ์ดํ•ด

- ํ•ด์™ธ ์—ฌํ–‰์— ๊ฒฐ๊ฒฉ ์‚ฌ์œ ๊ฐ€ ์—†์œผ์‹  ๋ถ„


[๊ฒฝ๋ ฅ 6๋…„ ์ด์ƒ]

- SoC ์ œํ’ˆ full-chip DFT ๊ตฌํ˜„๊ณผ sign-off, TO ๊ฒฝํ—˜

- SoC ์ œํ’ˆ DFT si. bring-up, diagnosis ๊ฒฝํ—˜

- Full-chip flatten/HPDF Synthesis, DFT, STA ์‹ค๋ฌด ๊ฐ€๋Šฅ์ž

- Foundation-IP, PHY/AMS IP integration ์œ ๊ฒฝํ—˜์ž

- ํ•ด์™ธ ์—ฌํ–‰์— ๊ฒฐ๊ฒฉ ์‚ฌ์œ ๊ฐ€ ์—†์œผ์‹  ๋ถ„


โ–ก ์šฐ๋Œ€ ์‚ฌํ•ญ

- Automotive SoC, NPU accelerator ๊ณผ์ œ ์œ ๊ฒฝํ—˜์ž(DFT, RTL2GDS)

Key Skills

DFTSoCEagle-NEagle-AATE

Industry

SemiconductorAutomotive

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BOS Semiconductors
Gyeonggi, South Korea, South Korea