Senior PCB Engineer -Module Lead

Company Description Unistring Tech Solutions Pvt. Ltd. (UTS), founded in 2007 by veteran DRDO scientists, is an indigenous defence R&D organization headquartered in Hyderabad, India. With a team of 500+ professionals, including over 250 dedicated R&D experts, UTS focuses on “Design in India, Make for the World” in Electronic Warfare, RADAR, and Simulation systems. The company has contributed critical technologies to Operation Sindoor and is the first Indian company to build subsystems of anti-drone systems in partnership with DRDO and private industry. UTS holds multiple patents and deep expertise across VLSI, Embedded Systems, Signal Processing, RF Hardware, Antennas, and AI, delivering spectrum dominance and mission superiority for the Indian Armed Forces. Its solutions are trusted by DRDO, BEL, ECIL, and the Indian Army, Navy, and Air Force, and the company is committed to making India a global hub for Electronic Warfare and RADAR while inspiring the next generation of innovators.

Role Description The Senior PCB Engineer - Module Lead will lead the design, development, and validation of complex, high-speed PCBs for defence-grade Electronic Warfare, RADAR, and related systems. This is a full-time, on-site role based in Hyderabad. Day-to-day responsibilities include schematic capture, multilayer PCB layout, component selection, and design reviews with cross-functional teams in hardware, RF, embedded, and mechanical engineering.

The role involves guiding junior engineers, defining PCB design guidelines, ensuring compliance with signal integrity, EMI/EMC, and reliability requirements, and coordinating with fabrication and assembly vendors. The Module Lead will also support bring-up, testing, debug, and documentation of PCB modules through the full product lifecycle.

Qualifications

• Extensive hands-on experience in PCB schematic design and multilayer PCB layout using industry-standard EDA tools (e.g., Cadence, Allegro).
• Knowledge of high-speed design, signal integrity, power integrity, and EMI/EMC considerations for defence and RF systems.
• Experience interfacing with RF, mixed-signal, and digital subsystems; familiarity with IPC standards and defence-grade qualification processes.
• Demonstrated ability to lead small teams, mentor junior engineers, and drive end-to-end ownership of PCB designs.