One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.
Are you inspired by a job that challenges you to be proactive, lead technology decisions, and come up with new ideas that will push a product above and beyond your competitor's products? Viasat is a unique blend of technical challenge, opportunity to excel, and team camaraderie, and opportunity to work with industry leaders!
As part of Viasat's CAD team, you will perform PCB design work, including component placement, complex routing, DRC and DFM checks, and documentation. Some of the daily tasks will involve using Siemens (formerly Mentor Graphics) Xpedition layout tools, including CES and EDM. Your build work will follow IPC standards, as well as company and contract manufacturing guidelines.
As a Senior Designer, you will participate in develop entry and exit reviews to ensure alignment with standards and processes. You will review data from Viasat’s Mechanical Engineering team to ensure the interface between these two databases is consistent. In addition, you will manage CAD file data, produce all output documentation for fabrication and assembly, and collaborate with other team members across all sites to ensure high-quality PCBs.
10+ years of experience doing PWB build layout.
5+ years of direct experience using Mentor Xpedition and CES.
Thorough understanding of PCB fabrication processes, tolerances, and IPC standards.
High-speed digital, analog, or mixed PWB Layouts.
Experience with crafting and editing electronic circuit diagrams.
Close work with mechanical engineering to define board profiles, technology, and board stack-ups. RF/Digital builds incorporating stringent mechanical definitions and complex component mounting.
Product documentation, including fabrication & assembly.
Associate degree in Electronics Engineering Technology or equivalent professional experience.
U.S. Citizenship required.
Bachelor’s degree in any engineering field or equivalent experience.
Multi-layer Flex and Rigid-flex circuits.
Experience in Blueprint Drawing software.
Complex Multi-layer PWB applying high speed materials, featuring micro strip, strip line and differential routing, controlled impedance, mix of low noise RF/analog circuitry.
Digital builds with various pin counts and fine pitch BGA’s, RF transmission lines, matched lengths, and delay control lengths.
Experience with JTAG, RGMI, DSP, DDR, LVDS, SERDES, and Ethernet build.
RF layout development with partitioning of circuits applying shields, specific mounting, and grounding requirements. All design criteria defined by engineering specifications.
Knowledgeable with hierarchical schematics and layout reuse schemes is a plus.
Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.