Program Lead Engineer - Embedded Systems

The Group You’ll Be A Part Of

In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry.

The Impact You’ll Make

As a Software Engineer at Lam, you will be at the forefront of innovation by designing, developing, and troubleshooting, and debugging software programs. Your role is pivotal in developing software tools that support design, infrastructure, and technology platforms. Your expertise will determine hardware compatibility and influence design, ensuring seamless integration between software and hardware.

In this role, you’ll make an impact across Lam’s entire product portfolio of equipment working within our centralized software engineering team, collaborating with some of the brightest minds in the industry.

What You’ll Do

• Firmware development on custom embedded platforms/solutions used in plasma etchers.
• BSP development and board bring up of the custom embedded platforms.
• Development of firmware that is used in the operation and control of peripheral devices such as: RTDs, thermocouples, electric actuators, stepper motors, heaters, pressure sensors, pressure controllers, flow controllers.
• Develop unit tests for the firmware modules
• Document the design details, Theory of operations, and develop test plan for firmware test coverage before release
• Involved in the design of test harnessing for remote testing of the Embedded system
  
  

Who We’re Looking For

• Bachelor’s/master’s degree in engineering (EE, ECE,CS or IS) with 5 to 12 years of experience
• Experience in embedded firmware architecture and development on designs with multiple analog and digital I/O capabilities, DSP and microcontrollers.
• Expert developer in embedded C/C++, QNX or other RTOS, Xilinx Zynq and Ultrascale SOC
• Should have experience working on QNX and developing board support packages (BSPs) for custom hardware. Should have written resource managers and devctls in QNX or other Posix based RTOS.
• Experience developing board support packages (BSPs) for custom hardware.
• Deep expertise in Embedded Firmware development, SW/HW /FW architecture partitioning.
• Must be well versed in communications protocols (SPI, I2C, EtherCAT, Ethernet, RS232)
• Expertise in debugging in Emulators such as JTAG.
• Experience in Python & EtherCAT
  
  

Preferred Qualifications

• Knowledge of digital signal processing: FFT, FIR, IIR.
• Must have experience working on electromechanical applications
• have experience and/or working knowledge of source code management tools like Git and Atlassian tool suite.
• The position requires excellent soft skills to be part of a cross functional team, excellent written & oral communication and presentation skills.
• Writing a firmware modules on actual HW in the lab
  
  

Our Commitment

We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.

Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.

Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.