PCIe Subsystem RTL lead

TylSemi 

📍 Bengaluru, India 🇮🇳

full-time
senior
Expired
Posted —
This job posting has expired View All RTL Design Engineer Jobs

Key Skills

PCIeRTLMACPHYSoC

Industry

SemiconductorAutomotive

Job Description

We are looking for a PCIe Sub-system Front-end RTL lead for next generation chiplet based SoCs for High-performance Compute and AI silicon .


Responsibilities 

·     Own the PCIe subsystem microarchitecture from the PHY interface through the MAC and Transaction Layer, defining the internal block boundaries, data paths, and control interfaces. 

·     Lead the integration of third-party PCIe controller and PHY hard IP, including wrapper RTL that adds mode selection, telemetry hooks, and bridging logic to the chiplet's internal fabric. 

·     Define and implement the bifurcation and lane-configuration logic, ensuring all supported lane-width configurations operate correctly across the full range of operating modes. 

·     Specify and drive implementation of the Transaction Layer pipeline: TLP reception, integrity checking, header classification, routing decisions, and handoff to downstream subsystems. 

·     Own the Virtual Channel and flow-control architecture, ensuring fair arbitration and back-pressure handling across all traffic classes. 

·     Define the integration interface to the PCIe subsystem such asTLP-to-flit adaptation, flow-control mapping, and error handling at the boundary. 

·     Collaborate with the management firmware team to define the PCIe register map, mode-select interface, and run-time telemetry structures exposed to the on-chip management processor. 

·     Work with the Physical Design Lead to meet timing closure requirements for the PCIe subsystem, including MAC-PHY interface timing, reset sequencing, and floorplan constraints. 

·     Hold the PCIe performance budget for each operating mode: bandwidth efficiency, latency through the Transaction Layer, and error recovery overhead. 

·     Define the PCIe power management architecture — link state transitions, ASPM policy, and integration with the chiplet-level power coordination scheme. 

·     Lead PCIe silicon bring-up planning: define bringup sequence, debug instrumentation requirements, loopback modes, and the hand-off criteria for production readiness. 

·     Mentor and guide RTL design engineers responsible for PCIe subsystem implementation, providing architectural guidance and RTL review. 

·     Partner with the DV team to define the PCIe UVM verification plan, coverage model, and protocol-checker requirements. 

·     Serve as the technical point of contact for PCIe-related customer integration questions, supporting anchor customer engagements on interface bring-up and interoperability. 

·     Author and maintain the PCIe subsystem micro-architecture specification, keeping it current through RTL implementation and sign-off. 


Required Qualifications 

·     10+ years of digital IC design experience, with at least 4 years focused on PCIe subsystem design or integration at the block-lead or module-owner level. 

·     Deep expertise in PCIe architecture: Transaction Layer, Data Link Layer, Physical Layer, TLP structure, flow control, Virtual Channels, and error handling. 

·     Hands-on experience integrating PCIe hard IP (controller and/or SerDes PHY) into production SoC or chiplet designs, including wrapper RTL, reset sequencing, and PnR constraints. 

  • Background in SR-IOV, multi-function device configuration, or host software driver interaction at the hardware level. 

·     Strong SystemVerilog RTL skills: able to write, review, and own production RTL for complex pipelined state machines, FIFOs, arbiters, and control logic. 

·     CXL 1.1/2.0 or 3.0 protocol knowledge, particularly CXL.io and CXL.mem transaction handling built on the PCIe fabric. 

·     Solid understanding of PCIe PHY-MAC interface protocols and timing requirements, 

·     Experience with PCIe compliance testing and PCI-SIG certification process — understanding of test requirements, common failure modes, and debug methodology. 

·     Familiarity with PCIe power management, L0s/L1 state machines, state transitions etc. 

·     Competency in multi-clock-domain design: async FIFO, CDC synchronizers, and clock crossing at the PCIe-to-internal-fabric boundary. 

·     BS/MS in Electrical Engineering, Computer Engineering, or equivalent. 

Preferred Qualifications 

·     Experience with UCIe or another die-to-die protocol at the PCIe TLP adaptation layer — mapping TLPs to a flit-based D2D transport. 

·     Prior experience with protocol bridging or gearbox designs that span multiple PCIe generations. 

·     Familiarity with  PCIe IP integration, including customization and support engagement. 

·     Experience at an advanced-node (7 nm or below) tape-out, particularly with the timing closure and floorplan considerations for designs.