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PCB layout Engineer, Transmission

Fether Labs ↗

📍 Shanghai, Shanghai, China, China 🇨🇳

full-time

mid-level

Posted —

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Key Skills

PCBCadenceDSPOIFEMI

Industry

TelecommunicationsConsumer Electronics

Job Description

该职位来源于猎聘 Job Requirements Education:

Bachelor’s or Master’s degree in Electrical Engineering, Electronics, Telecommunications, or a related technical field.
Coursework or research focus on high-frequency circuit design, electromagnetic fields, or signal integrity analysis is highly preferred.
Relevant certifications in advanced PCB design tools (e.g., Cadence Allegro Expert, HyperLynx SI/PI) or IPC CID/CID+ certification are considered a strong plus.
Continuous professional development in emerging optical interconnect standards (OIF CEI, IEEE 802.3) is expected. Experience:
Minimum of 3 years of dedicated PCB layout experience, with at least 1 years specifically focused on high-speed optical modules or coherent DSP-based systems.
Proven track record of designing multi-layer HDI boards featuring fine-pitch BGA breakout for high-performance DSPs and drivers.
Extensive hands-on experience with high-speed serial interfaces including 112G PAM4, and OIF-CEI standards, ensuring compliance with strict loss budgets and crosstalk requirements.
Demonstrated success in managing the full design cycle from concept and schematic capture review to prototype bring-up, debugging, and volume production release.
Experience working in cross-functional teams within the optical networking industry, familiar with module packaging constraints (thermal, mechanical, fiber management).
Prior involvement in designs utilizing advanced materials (low-loss laminates) and advanced manufacturing technique (e.g., mSAP) to minimize insertion loss.
Familiarity with regulatory compliance testing (FCC, CE) and the ability to implement layout changes based on EMI/EMC pre-compliance results. Special Skills:
EDA Tool Mastery: Expert-level proficiency in Cadence Allegro PCB Editor or Altium Designer or Mentor and Constraint Manager.
Deep understanding of differential pair routing, length matching, via stubbing mitigation, back-drilling requirements, and reference plane continuity.
Ability to design thermal dissipation in high-power density modules, including thermal via arrays, copper balancing, and collaboration with mechanical engineers on enclosure fit.
Strong knowledge of PCB fabrication capabilities (HDI, laser drilling, sequential lamination) and SMT assembly processes to optimize yield and testability.
Excellent analytical skills to troubleshoot signal integrity issues, ground bounce, and power noise during lab characterization and validation phases.
Knowledge of Python or AI-Agent assisted programming for structured data analysis, test automation is preferred.
Language: Professional proficiency in English (written and spoken) for global team collaboration and technical documentation. Competencies: Individual Contributors Adaptability, Innovation, Problem Solving, Continuous Improvement, Reliable and Dependable, Results Oriented, Work Standards/Quality/Details

Job Element Wt % Specific Duty 1) Work on New Product Initiatives 90% A) PCB layout design for optical pluggable B) Work with SI/PI, HW engineer to optimize layout and EMC 2) Team Build and Others

10% A) Contribute to improving work efficiency

B) Team cooperation with other functional teams