Hardware Development Engineer, RBKS Camera ASIC

Ring 

📍 Taipei, Taiwan 🇹🇼

full-time
senior
Posted —

Key Skills

ASICI2CSPIUARTMIPI

Industry

Consumer ElectronicsSemiconductor

Job Description

Description

Ring is looking for a Hardware Development Engineer to join the RBKS ASIC team, playing a critical role in silicon bring-up and product integration for our custom SoCs. You will be the on-site engineering presence ensuring our ASICs integrate flawlessly into Ring's next-generation smart home devicesRing product teams are integrating our custom ASIC into multiple device programs simultaneously. This role provides dedicated hardware engineering support for chip bring-up at contract manufacturers and ensures smooth ASIC-to-board integration across EVT/DVT/PVT phases.

Key job responsibilities

  • Support on-site chip bring-up at contract manufacturers in Vietnam and China
  • Perform and review schematic designs for ASIC integration into Ring products
  • Develop and execute board-level diagnostic and validation plans
  • Interface with Ring product hardware teams on ASIC-specific integration issues (power sequencing, signal integrity, thermal)
  • Drive root-cause analysis and resolution for hardware issues identified during bring-up and validation
  • Collaborate with the ASIC design team to feed back board-level observations into future silicon revisions
  • Support component qualification, second-source evaluation, and manufacturing readiness
  • Travel to CM sites (approximately 20–30%) to support critical bring-up milestones
  • Supporting post-silicon validation and debug activities
  • Working closely with mixed-signal vendors and cross-functional engineering teams
  • Strong ASIC bring-up, validation, and HW/SW integration experience

A day in the life

In the lab, you'll be probing signals, debugging post-silicon issues, and validating peripheral interfaces. You'll drive first-article bring-up and ensure production test coverage catches real-world failures.

About The Team

We're a small, nimble ASIC team building Ring's custom silicon from the ground up. We work in a vertically integrated environment where you see your work directly impact the products millions of customers rely on daily.

Basic Qualifications

  • Master's degree in electrical engineering or equivalent
  • 5+ years of hardware design and validation of components, subsystems and systems experience
  • Experience with SOC bring-up and post-silicon validation
  • Experience in motherboard design, PCB design including schematic capture, stackup and circuit board layout
  • Experience supporting product builds at contract manufacturers through production phases

Preferred Qualifications

  • Experience in system-level integration - Audio, Power, Battery management, RF, ESD, or equivalent
  • Knowledge of standard hardware interfaces: I2C, SPI, UART, MIPI, USB, DDR, SDIO
  • Experience with camera, WiFi, or BLE subsystem hardware integration

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.


Company - Amazon Development Center Taiwan Limited - H44

Job ID: A10464497