π Santa Monica, California
Snap develops software and hardware products, including the Snap Camera and Spectacles, from its headquarters in Santa Monica, California. The company focuses on augmented reality and social media applications, enabling users to create and share engaging content across various platforms. Engineering teams work on embedded systems, ASIC verification, and PCB design, addressing challenges in real-time image processing and connectivity. With a diverse range of roles and a commitment to advancing AR technology, Snap fosters a collaborative environment for engineers to innovate and push the boundaries of digital interaction.
Embedded Systems Security Engineer
@ Snap Inc.
Embedded Software/Firmware Test Engineer
@ Snap Inc.
Software Engineer, Embedded
@ Snap Inc.
Embedded Engineer, Operating System
@ Snap Inc.
PCB Design Engineer
@ Snap Inc.
Embedded Engineer, Camera
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
PCB Design Engineer, Level 5
@ Snap Inc.
PCB Design Engineer, Level 5
@ Snap Inc.
PCB Design Engineer, Level 5
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
Embedded Software Engineer, Level 5
@ Snap Inc.
Embedded Engineer
@ Snap Inc.
Embedded Software Engineer, Level 3
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
Embedded Software Engineer, Power, Level 5
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
PCB Design Engineer
@ Snap Inc.
Embedded Software Engineer, AI, Level 5
@ Snap Inc.
Embedded Software Engineer, AI, Level 4
@ Snap Inc.
PCB Fab DFM/SMT Engineer
@ Snap Inc.
Embedded Software Engineer, Audio, Level 5
@ Snap Inc.
Embedded Software Engineer, Audio, Level 5
@ Snap Inc.
Embedded Software Engineer, Cellular, Level 5
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
PCB Design Engineer, Level 5
@ Snap Inc.
Embedded Engineer, Operating System
@ Snap Inc.
Embedded Engineer, Graphics
@ Snap Inc.
Embedded Engineer, C++
@ Snap Inc.
Embedded Software Engineer, Level 4
@ Snap Inc.
Embedded Software Engineer, Cellular, Level 5
@ Snap Inc.
ASIC Package Engineer
@ Snap Inc.
ASIC Package Engineer
@ Snap Inc.
Embedded Software Engineer
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
PCB Design Engineer, Level 5
@ Snap Inc.
RTL Design Engineer
@ Snap Inc.
PCB Fab DFM/SMT Engineer
@ Snap Inc.
PCB Design Engineer, Level 5
@ Snap Inc.
Robotics Engineer
@ Snap Inc.
PCB Design Engineer, Level 6
@ Snap Inc.
Software Engineer, Embedded, Level 5
@ Snap Inc.
Software Engineer, Embedded, Level 4
@ Snap Inc.
Software Engineer, Embedded, Level 4
@ Snap Inc.
Embedded Engineer
@ Snap Inc.
Embedded Software Engineer
@ Snap Inc.
Embedded Software Engineer, Level 3
@ Snap Inc.
PCB Design Engineer, Spectacles, L5
@ Snap Inc.
PCB Design Engineer, Spectacles, L5
@ Snap Inc.
Embedded Engineer
@ Snap Inc.
Embedded Engineer
@ Snap Inc.
Software Engineer, Embedded, Level 4
@ Snap Inc.
Software Engineer, Embedded, Level 4
@ Snap Inc.
Software Engineer, Embedded, Level 4
@ Snap Inc.
Software Engineer, Embedded Video
@ Snap Inc.
PCB Design Engineer
@ Snap Inc.
Software Engineer, Embedded Video
@ Snap Inc.
PCB Design Engineer
@ Snap Inc.
Software Engineer, Embedded
@ Snap Inc.
Software Engineer, Embedded
@ Snap Inc.
Software Engineer, Embedded Open XR
@ Snap Inc.
PCB Design Engineer
@ Snap Inc.
PCB Design Engineer
@ Snap Inc.
Embedded Software Engineer, Cellular, Level 5
@ Snap Inc.
Embedded Software Engineer, Cellular, Level 5
@ Snap Inc.
ASIC Verification Engineer
@ Snap Inc.
Software Engineer, Embedded Open XR
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
Software Engineer, Embedded, Level 3
@ Snap Inc.
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Snap develops software and hardware products, including the Snap Camera and Spectacles, from its headquarters in Santa Monica, California. The company focuses on augmented reality and social media applications, enabling users to create and share engaging content across various platforms. Engineering teams work on embedded systems, ASIC verification, and PCB design, addressing challenges in real-time image processing and connectivity. With a diverse range of roles and a commitment to advancing AR technology, Snap fosters a collaborative environment for engineers to innovate and push the boundaries of digital interaction.
Snap Inc. currently has 2 active embedded systems positions in 1 location. All positions are on-site, typical for hardware-focused roles requiring lab access and equipment. Recognized as a top-tier employer (80.0/100), Snap Inc. offers competitive compensation and strong career development paths in embedded engineering.
* Data represents job posting activity over the past 6 months: Feb 2026 through Jul 2026
Snap Inc. maintains steady recruitment patterns with 2
positions this month,
suggesting consistent team growth and ongoing engineering needs.
Over the past 6 months, Snap Inc. averaged 2.8 job postings per month,
with peak hiring in Feb 2026 (10 openings).
For embedded systems roles, hiring activity typically correlates with product development cycles,
especially for firmware teams during pre-production phases and hardware engineers during prototyping.
β‘οΈ Stable pace
Consistent hiring velocity
Feb 2026
C++ is the most in-demand skill at Snap Inc.,
appearing in 57% of all job listings (past and present).
This skill is important but not universal, indicating diverse technical needs across different product lines or teams.
Snap Inc.'s technology stack spans 92 distinct skills and tools,
reflecting the multifaceted nature of embedded systems development.
The broad technical diversity (92 technologies) suggests work on complex,
multi-domain projects requiring both hardware and software expertise.
Engineers joining Snap Inc. should combine depth in key areas with adaptability. The mix of hardware skills (PCB design, schematics) and firmware expertise (RTOS, embedded C) indicates full-stack embedded development where engineers work across the hardware-software boundary. Candidates with adjacent skills (version control, testing frameworks, communication protocols) typically advance faster by contributing across the development lifecycle.
Snap Inc. is building across 2 distinct engineering specializations, reflecting varied technical needs. This diversity suggests cross-functional projects where firmware engineers, hardware designers, and systems architects collaborate on integrated solutions.
Experience level distribution: 100% of openings target senior-level engineers.
Snap Inc. operates across 5 countries with 13
total hiring locations. Multi-geography recruitment typically indicates either distributed engineering teams,
expansion into new markets, or proximity to manufacturing and customer operations.
San Diego, United States serves as a primary hiring hub with 27% of all roles
(21 positions).
Engineering capabilities are distributed relatively evenly across locations, suggesting a
genuinely multi-site development model rather than a single headquarters-centric approach.
These employers share technical focus areas with Snap Inc. and are actively hiring embedded engineers. Exploring multiple companies helps candidates understand market compensation, compare technical challenges, and identify the best cultural and technical fit for their career goals.
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