looking for a
Power Electronics Reliability Engineer
with hands-on experience performing
DFMEA and MTBF analysis on power electronics products
. This is much more of a reliability-focused role than a traditional validation or test engineering position. 5+ years of experience. Needs demonstrated power electronics experience not HIL or software test.
Key Requirements:
-
Experience leading or performing
DFMEA (Design Failure Mode & Effects Analysis)
on power electronics products.
-
Experience developing
MTBF/MTTF reliability calculations and models
.
-
Ability to review power electronics designs and identify potential failure modes and downstream impacts.
-
Strong understanding of power electronic components including:
-
Silicon carbide (SiC) MOSFETs
-
IGBTs
-
Capacitors
-
Resistors
-
Gate drive circuits
-
Ability to analyze what happens when components fail (shorts, opens, over-current, over-voltage, thermal events, noise susceptibility, etc.).
-
Comfortable reviewing schematics, component datasheets, and stress/derating conditions to identify reliability risks before product release.
Examples of the Type of Experience Needed:
-
Determining what happens if a SiC MOSFET or IGBT shorts and understanding the impact on downstream components.
-
Identifying scenarios where excessive current through a resistor could create a thermal or fire risk.
-
Evaluating capacitor voltage stress, electrical noise susceptibility, and other reliability concerns.
-
Using DFMEA findings to drive design improvements and validation testing.
Additional Experience Desired:
-
Power conversion products such as drives, inverters, DC/DC converters, motor controls, or similar power electronics systems.
-
Reliability testing, validation, root cause analysis, and field failure investigations.
-
Experience with standards-based reliability methods (MIL-HDBK-217, Telcordia, Physics-of-Failure, etc.).
Target Candidate:
Someone who has spent years performing DFMEA and MTBF analysis on power electronics hardware and can quickly identify failure mechanisms, component stress issues, and reliability risks within a design.