PCB & Substrate Layout Engineer

Title: Principal PCB & Substrate Layout Engineer (Cadence APD+)

Location: Remote

Employment Type: Contract (6+ Months)

Status: Accepting Candidates

About the Role

We are seeking a Principal PCB & Substrate Layout Engineer with deep expertise in advanced substrate development and Cadence APD+.

This position will focus on the design and development of complex high-density substrates, advanced packaging technologies, FPGA packaging solutions, and next-generation electronic assemblies supporting aerospace and defense applications.

The ideal candidate possesses extensive experience with Cadence APD+, substrate design rules, HDI technologies, and advanced packaging methodologies.

Key Responsibilities

• Substrate Development & Layout
• Develop advanced substrate layouts utilizing Cadence APD+
• Design high-density interconnect (HDI) substrates
• Create complex package layouts supporting advanced electronic systems
• Support advanced packaging initiatives including 2.5D and stacked package technologies
• Advanced Packaging Design
• Design and develop:
• Interposers
• Substrates
• Flip-Chip Packages
• Die Stacking
• Package Stacking
• Substrate Stacking
• Support high-performance package architectures
• Implement advanced packaging methodologies for complex products
• Constraint Management & Design Rules
• Utilize Cadence APD+ Physical Constraint Editor
• Utilize Cadence APD+ Electrical Constraint Editor
• Develop and maintain substrate design rules
• Ensure compliance with manufacturing and assembly requirements
• HDI & High-Speed Design
• Design HDI stack-ups incorporating:
• Blind Vias
• Buried Vias
• Microvias
• Support fine-line routing requirements
• Optimize layouts for:
• Signal Integrity
• Power Integrity
• Manufacturability
• Manufacturing Support
• Generate fabrication and assembly documentation
• Validate manufacturing data using CAM tools
• Collaborate with fabrication vendors and manufacturing teams
• Support design reviews and technical assessments
• Cross-Functional Collaboration
• Partner with:
• Electrical Engineering
• Mechanical Engineering
• Manufacturing Engineering
• Support 3D package modeling and fit-check activities
• Participate in thermal and mechanical design reviews

Qualifications

• Bachelor's Degree in Engineering or equivalent experience
• 10+ years of PCB and/or Substrate Layout experience
• Expert-level experience with:
• Cadence APD+
• Advanced Package Designer
• Extensive experience with:
• Substrate Development
• Substrate Design Rules
• HDI Technologies
• Experience with:
• FPGA Package Design
• Package Layout
• High-Speed Designs
• Strong understanding of:
• Digital Layout
• Analog Layout
• RF Layout Techniques

Preferred Qualifications

• 2.5D Packaging
• Interposer Design
• Flip-Chip Packaging
• Die Stacking
• Package Stacking
• Substrate Stacking
• CAM350
• BluePrint
• RF Packaging
• Thermal Modeling Collaboration
• Aerospace & Defense Experience

Industry Standards

• Experience with:
• IPC Standards
• EDEC Standards
• Fabrication Specifications
• Assembly Specifications
• Electronic Packaging Standards

Compensation

• $85-$90/hr W2
• 6+ Month Contract
• Location: Phoenix, AZ