PCB Design Senior Engineer

The Role

We are looking for a Senior PCB Design Engineer with strong EDA library ownership and advanced high‑speed board design experience to drive the implementation of our next‑generation data center accelerator platforms .

In this role, you will be responsible for the complete PCB design process , from library definition and design rules , through floorplanning, routing, and tape‑out , while collaborating closely with Signal Integrity (SI) and Power Integrity (PI) experts to define layer stacks, PDN strategies, and constraints .

This is a hands‑on, technically demanding role focused on very high‑density, high‑layer‑count boards , pushing the limits of power delivery, memory integration, and high‑speed interfaces , using Siemens Xpedition as the primary design environment.

Key Responsibilities

• Design and layout complex, high‑layer‑count PCBs for accelerator and data center platforms
• Own and maintain EDA libraries (symbols, footprints, padstacks, constraints)
• Define routing constraints and complex design rules for high‑speed and high‑power designs
• Collaborate with SI/PI teams on layer stack‑ups, impedance control, and PDN design
• Collaborate with mechanical and thermal experts to ensure design integration
• Drive designs from concept through tape‑out, including manufacturing deliverables
• Support DFM reviews, board bring‑up, and hardware debug activities
  
  

Required Qualifications

• Bachelor’s and Master’s degree in Electrical Engineering or related field.
• 5+ years of hands‑on PCB layout experience in complex hardware programs.
• Strong experience with Siemens Xpedition (layout and library tools strongly preferred).
• Proven background designing high‑speed, high‑layer‑count boards.
• Solid understanding of:
• Signal Integrity and Power Integrity fundamentals
• Controlled impedance routing
• High‑density interconnects and advanced packages
• Experience creating and maintaining EDA component libraries.
• Ability to work effectively with cross‑functional teams (SI, PI, schematic, ME, manufacturing).
  
  

Preferred Qualifications

• Experience with data‑center, accelerator, networking, or HPC hardware.
• Direct involvement in memory subsystem integration and high‑speed serial interfaces.
• Familiarity with SI/PI simulation workflows and constraint‑driven design.
• Experience defining layer stacks in collaboration with fabricators and SI/PI teams.
• Knowledge of DFM/DFT/DFX principles for high‑volume and advanced PCB manufacturing.
• Comfortable working in fast‑moving, technically ambitious engineering environments.
  
  

What do we offer?

• Join an innovative team and experience company growth.
• We believe in investing in our employees and providing them with the opportunities they need to grow and develop their careers.
• Enjoy a hybrid work environment.
• We also offer flexible schedule.
• We offer a remuneration that values your experience.
• The position will have preferably the base in Karlsruhe (Germany).
  
  

We are looking for outstanding people willing to join our mission to change this industry and help to build a better world.

If you feel identified with Openchip, please contact us. We can offer a competitive compensation package in a flexible work schema that will help you to keep a balance between your personal and professional life.

At Openchip & Software Technologies S.L., we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued, respected, and empowered to reach their full potential – regardless of race, gender, ethnicity, sexual orientation, or gender identity.