PCB Design Engineer

Job Title: Electrical PCB Design Engineer

Location: Phoenix, AZ (100% Onsite – 5 Days/Week)

Client: Defence client

Duration : 12 Months Plus Extension

Description:

What are your TOP 3 must haves for this role:

• Substrate development; Expert in Cadence APD+; Expert in substrate design rules

• High-Speed Interfaces and High-Density Substrates layout techniques and understanding and improving our layout development processes to ensure we produce quality products using your expertise in PCB and Substrate layout engineering.

• BS and 10+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+

• High-density interposers, substrates, and PCB layouts: power, digital, analog, and RF signals across multiple die (primarily flip-chip)

• Hands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.

• Support package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant

• Experience with APD+ physical and electrical constraint editor

• HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below

• Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques

• Cadence schematic / netlist driven CAD layout process, e.g. Cadence APD+ (Allegro) and supporting tools

• High-end FPGA package or board design experience

• Ability to work with our Mechanical team to design full 3D models for fit checks and thermal

• Understanding of layout techniques in Digital, Analog, and/or RF layouts

• Electronic packaging techniques; CAM package for manufacturing data validation (CAM350 & Blueprint)

• JEDEC /IPC design, fabrication, and assembly specifications

Creating assembly documentation and fabrication deliverables per company and industry standards