Digantara is a leading
Space Surveillance and Intelligence
company focused on ensuring orbital safety and sustainability. With expertise in space-based detection, tracking, identification, and monitoring, Digantara provides comprehensive domain awareness across regimes, allowing end users to have actionable intelligence on a single platform. At the core of its infrastructure lies a sophisticated integration of hardware and software capabilities aligned with the key principles of situational awareness: perception (data collection), comprehension (data processing), and prediction (analytics). This holistic approach empowers Digantara to monitor all Resident Space Objects (RSOs) in orbit, fostering comprehensive domain awareness.
Digantara seeks a highly skilled
Senior PCB Design Engineer
to design and develop cutting-edge PCB schematics and layouts tailored specifically for FPGA-based high-speed digital systems. You will leverage your expertise to enable state-of-the-art embedded hardware development with applications such as tracking objects from both space and the ground.
Why Us?
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Be part of a collaborative and innovative environment where your ideas and skills make a real difference to the entire space realm.
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Push the boundaries with hands-on experience, greater responsibilities, and rapid career advancement.
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Competitive incentives, galvanising workspace, blazing team, frequent outings—pretty much everything that you have heard about a startup.
Responsibilities
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Designed and developed high-quality PCB schematics and layouts for FPGA-based systems and CMOS image sensor boards, ensuring compliance with industry standards.
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Design and develop complex PCB schematics and layouts, optimizing signal and power integrity, using industry-standard CAD tools (e.g., Altium Designer, Cadence OrCAD).
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Implement power and thermal management solutions and apply EMI/EMC mitigation techniques.
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Implement PCB design guidelines for satellite electronics hardware across the entire PCB design lifecycle.
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Collaborate with hardware, software, and system engineers to understand functional requirements, optimize PCB designs, and define and refine electrical circuit designs.
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Collaborate with vendors to ensure high-quality PCB manufacturing and assembly for satellite applications.
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Develop and execute test plans to validate the hardware performance of high-speed FPGA boards and CMOS image sensor boards.
Required Qualifications
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Bachelor's or Master's in Electronics/Electrical Engineering or a related field.
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5+ years of experience in PCB schematic, layout design, and development, focusing on High-speed FPGA-based digital and mixed-signal designs.
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Proven track record in building high-speed multi-layer PCBs employing FPGAs, DDR, LVDS, SERDES, Ethernet, USB, SRAM, Flash memories, etc.
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Proficiency in schematic design and PCB layout using tools such as Altium Designer or Cadence Allegro.
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Understanding of thermal management in embedded hardware.
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Strong understanding of signal integrity and power integrity concepts and experience with advanced simulation tool-based analysis.
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Generation and review of design outputs (Netlist, Gerber files, bill of materials) and ensure design for manufacturability and testability.
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Experience working with vendors for PCB fabrication and assembly, BOM management, and hardware assembly.
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Strong problem-solving skills with the ability to troubleshoot and debug FPGA-based hardware issues, especially in imaging systems.
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Stay updated on emerging technologies and best practices in high-speed digital design, mixed-signal design, PCB layout, and relevant areas of expertise.
Preferred Skills
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Experience in PCB design for satellite applications, particularly satellite bus/payload electronics for imaging systems and PCB design for CMOS imaging sensors and electronics, is highly valued.
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Experience in FPGA-based hardware bring-up and functional testing, including debugging, validation, and integration with ground or space-based imaging systems.
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Working knowledge of Power circuits, Embedded systems, FPGA/SoC architecture, interface devices, and data communication protocols.
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Familiarity with PCB design for imaging systems with CMOS imaging sensors/Photodetectors.
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Select appropriate components and peripherals for the PCB design, considering factors such as performance, cost, and availability.
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Knowledge of industry standards for PCB design (e.g., IPC-6012DS) and PCB manufacturing processes (e.g., SMT, through-hole).
General Requirements
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Ability to work in a mission-focused, operational environment.
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Ability to think critically and make independent decisions.
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Interpersonal skills to enable working in a diverse and dynamic team.
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Maintain a regular and predictable work schedule.
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Writing and delivering technical documents and briefings.
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Verbal and written communication skills, as well as organizational skills.
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Travel occasionally as necessary.
Work Location:
Hebbal, Bangalore
PI270473231