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Varni Digital

Hardware/PCB Design Engineer

Varni Digital

📍 Vadodara, India 🇮🇳

full-time
mid-level
on-site
Posted —

Key Skills

MCUPCBSMPSAC-DCdriver

Industry

Consumer ElectronicsIndustrial Automation

Job Description

Company Name: Varni Digital Private Limited

Onsite (Vadodara Location)

Post: Hardware/PCB Design Engineer


Company Description

Varni Digital Private Limited, established in 2014, specializes in innovative home automation solutions tailored to the rapidly changing demands of modern lifestyles. As a proud Indian manufacturer, we produce high-quality Smart Touch Switches, Remote Switches, and a range of advanced Home Automation Products. Our products are made using premium-grade materials, undergo rigorous quality checks, and adhere to industry standards. We are committed to delivering intelligent solutions that enhance convenience and efficiency for our customers.


Key Responsibilities

  • Design schematic and PCB layouts for MCU-based embedded hardware.
  • Develop AC-DC, DC-DC, and SMPS power circuits.
  • Design driver circuits for loads such as LEDs, motors, relays, or other power stages as required.
  • Work on sensing, protection, isolation, filtering, and signal conditioning circuits.
  • Select components considering efficiency, thermal performance, reliability, and manufacturability.
  • Perform board bring-up, debugging, validation, and failure analysis.
  • Coordinate with firmware, mechanical, and manufacturing teams.
  • Support prototype builds, design reviews, and production release.simplyhired.co


Required Skills

  • Strong experience in MCU-based hardware design.
  • Hands-on experience in schematic capture and PCB layout.
  • Good understanding of SMPS, AC-DC, DC-DC, power management, and driver design.
  • Experience with analog and digital circuit design.
  • Knowledge of protection circuits, MOSFETs, gate drivers, current sensing, and isolation.
  • Familiarity with debugging tools such as oscilloscope, multimeter, power supply, and logic analyzer.
  • Exposure to EMI/EMC, thermal design, and power integrity considerations.