Role Description
As a Firmware Engineer Lead, you will oversee the design, development, and implementation of embedded software for cutting-edge chip-to-chip solutions. You will lead debugging efforts, collaborate closely with cross-functional teams to ensure seamless integration, and provide technical mentorship to team members. This is a full-time, on-site position located in Bengaluru, where you will play a pivotal role in advancing Kandou’s innovative technology for next-generation electronics.
Qualifications
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Strong academic and technical background in electrical engineering. At a minimum, a Bachelor’s in EE or Computer Science is required, and a Master’s is preferred.
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Minimum 12+ years’ (Lead/Architect) experience supporting or developing complex SoC/silicon products for Server, Storage, and/or Networking applications
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Experience developing firmware to execute in on-chip microcontrollers as well as C-language software development kits (SDKs) to execute on system management controllers (e.g. BMC).
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Experience working with logic designers to architect and verify HW-SW interfaces on complex SoCs.
Required Experience:
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Experience developing embedded firmware for PCIe products.
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High level of proficiency in C (preferred) or C++, including development of C-based SDKs.
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High level of proficiency in Python for automating pre-processors/post-processors.
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Working knowledge of software/firmware build environments, gcc/Make, Doxygen, and GitHub.
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Hands-on experience with Server, Storage, and/or Networking equipment (e.g. Network Switches).
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Familiarity with SoC interfaces to common IP blocks such as PCIe Controllers, NVME Controllers, AMBA/AHB interfaces, on-chip memory interfaces, and other similar interfaces
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Direct experience working on products with high-speed interfaces common in Data Center equipment: PCI- Express (Gen-3 and above), 100/400G Ethernet, Infiniband, NVMe, etc