π Santiago de Compostela, Spain
Televes manufactures telecommunications equipment, including antennas, amplifiers, and fiber optic solutions, from its headquarters in Santiago de Compostela, Spain. The company serves various markets, focusing on broadcasting, telecommunications, and broadband services. Engineering disciplines at Televes include RF engineering, PCB design, and optical fiber technology. Engineers work on developing high-performance products that meet stringent industry standards. While specific employee counts are not publicly available, Televes has a notable presence in the telecommunications sector across Europe and Latin America.
Ingeniero/a CAM PCB
@ Televes
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Televes manufactures telecommunications equipment, including antennas, amplifiers, and fiber optic solutions, from its headquarters in Santiago de Compostela, Spain. The company serves various markets, focusing on broadcasting, telecommunications, and broadband services. Engineering disciplines at Televes include RF engineering, PCB design, and optical fiber technology. Engineers work on developing high-performance products that meet stringent industry standards. While specific employee counts are not publicly available, Televes has a notable presence in the telecommunications sector across Europe and Latin America.
Televes currently has 1 active embedded systems position in 1 location. All positions are on-site, typical for hardware-focused roles requiring lab access and equipment. Recognized as a top-tier employer (85.0/100), Televes offers competitive compensation and strong career development paths in embedded engineering.
* Data represents job posting activity over the past 6 months: Jan 2026 through Jun 2026
Hiring momentum at Televes is currently increasing, with 1
opening posted this month compared to 0 last month.
This upward trend often signals product development acceleration, team scaling, or new project initiatives.
Over the past 6 months, Televes averaged 0.2 job postings per month,
with peak hiring in Jun 2026 (1 openings).
For embedded systems roles, hiring activity typically correlates with product development cycles,
especially for firmware teams during pre-production phases and hardware engineers during prototyping.
π New hiring activity
Consistent hiring velocity
Jun 2026
PCB is the most in-demand skill at Televes,
appearing in 100% of current job listings.
This universal requirement indicates PCB forms the core of Televes's
technical stack across all engineering teams.
Televes's technology stack spans 5 distinct skills and tools,
reflecting the multifaceted nature of embedded systems development.
The focused skill requirements suggest specialized work in specific embedded domains.
Televes is currently hiring for a focused PCB Design Engineer position, likely to address a specific technical gap or project need.
Experience level distribution: 100% of openings target mid-level-level engineers.
Televes's engineering operations are concentrated in a single country across 1 location. A single-location focus enables tight team collaboration and simplified operations, particularly valuable for hardware-intensive development requiring shared lab facilities.
These employers share technical focus areas with Televes and are actively hiring embedded engineers. Exploring multiple companies helps candidates understand market compensation, compare technical challenges, and identify the best cultural and technical fit for their career goals.
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