๐ Thousand Oaks, CA
Teledyne develops advanced instrumentation, digital imaging, and software solutions from its headquarters in Thousand Oaks, California. The company serves markets such as aerospace, defense, and industrial automation, with products including high-performance sensors, data acquisition systems, and imaging systems for various applications. Engineering disciplines at Teledyne encompass embedded software development, FPGA design, and ASIC engineering. Teams focus on optimizing performance for real-time data processing and signal integrity in complex systems. With a strong presence in both hardware and software domains, Teledyne employs a diverse workforce dedicated to solving engineering challenges across multiple sectors.
Sr. ASIC Layout Design Engineer
@ Teledyne Technologies Incorporated
Analog Design Engineer
@ Teledyne Technologies Incorporated
Firmware Engineer
@ Teledyne Technologies Incorporated
Firmware Engineer
@ Teledyne Technologies Incorporated
ASIC Digital Design Engineer
@ Teledyne Technologies Incorporated
Senior IC Design Engineer
@ Teledyne Technologies Incorporated
FPGA algorithm specialist
@ Teledyne Technologies Incorporated
ASIC Digital Design Engineer
@ Teledyne Technologies Incorporated
Field Application Engineer
@ Teledyne Technologies Incorporated
Embedded Software Engineer
@ Teledyne Technologies Incorporated
Senior or Principal FPGA Engineer
@ Teledyne Technologies Incorporated
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Teledyne develops advanced instrumentation, digital imaging, and software solutions from its headquarters in Thousand Oaks, California. The company serves markets such as aerospace, defense, and industrial automation, with products including high-performance sensors, data acquisition systems, and imaging systems for various applications. Engineering disciplines at Teledyne encompass embedded software development, FPGA design, and ASIC engineering. Teams focus on optimizing performance for real-time data processing and signal integrity in complex systems. With a strong presence in both hardware and software domains, Teledyne employs a diverse workforce dedicated to solving engineering challenges across multiple sectors.
Teledyne Technologies Incorporated operates in the embedded systems space with focus on Software Development. While no positions are currently listed, embedded companies often hire in cycles tied to product launches, R&D phases, or contract milestones. Engineers interested in Teledyne Technologies Incorporated should monitor for openings in firmware development, hardware design, and systems architecture.
* Data represents job posting activity over the past 6 months: Nov 2025 through Apr 2026
Hiring momentum at Teledyne Technologies Incorporated is currently increasing, with 3
openings posted this month compared to 1 last month.
This upward trend often signals product development acceleration, team scaling, or new project initiatives.
Over the past 6 months, Teledyne Technologies Incorporated averaged 1.3 job postings per month,
with peak hiring in Apr 2026 (3 openings).
For embedded systems roles, hiring activity typically correlates with product development cycles,
especially for firmware teams during pre-production phases and hardware engineers during prototyping.
๐ +200% growth
Consistent hiring velocity
Apr 2026
Python is the most in-demand skill at Teledyne Technologies Incorporated,
appearing in 36% of all job listings (past and present).
This skill is important but not universal, indicating diverse technical needs across different product lines or teams.
Teledyne Technologies Incorporated's technology stack spans 38 distinct skills and tools,
reflecting the multifaceted nature of embedded systems development.
The broad technical diversity (38 technologies) suggests work on complex,
multi-domain projects requiring both hardware and software expertise.
Engineers joining Teledyne Technologies Incorporated should combine depth in key areas with adaptability. The mix of hardware skills (PCB design, schematics) and firmware expertise (RTOS, embedded C) indicates full-stack embedded development where engineers work across the hardware-software boundary. Candidates with adjacent skills (version control, testing frameworks, communication protocols) typically advance faster by contributing across the development lifecycle.
Teledyne Technologies Incorporated operates across 6 countries with 8
total hiring locations. Multi-geography recruitment typically indicates either distributed engineering teams,
expansion into new markets, or proximity to manufacturing and customer operations.
Goleta, United States serves as a primary hiring hub with 36% of all roles
(4 positions).
Engineering capabilities are distributed relatively evenly across locations, suggesting a
genuinely multi-site development model rather than a single headquarters-centric approach.
These employers share technical focus areas with Teledyne Technologies Incorporated and are actively hiring embedded engineers. Exploring multiple companies helps candidates understand market compensation, compare technical challenges, and identify the best cultural and technical fit for their career goals.
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