Head of IC Design

Description

Role Purpose

Lead Power Integrations’ global IC design organization, ensuring the successful and predictable execution of all silicon development aligned to product architectures and Market-driven roadmaps.

This role owns the delivery of high-quality, manufacturable ICs, translating product and system requirements into silicon while maintaining strong execution discipline, risk management, and cross-functional alignment.

Working closely with Product & Technology Development, Marketing, Operations, and Business Units, this leader ensures silicon delivery meets performance, cost, quality, and schedule commitments.

Business Ownership & Impact

• Own execution and delivery of all IC development programs.
• Ensure predictable silicon delivery aligned to product commitments.
• Drive improvements in:
• First-pass silicon success
• Development cycle time
• Design productivity and reuse
• Balance design innovation with execution risk and schedule confidence.
• Ensure designs meet:
• Performance targets
• Cost and area targets
• Manufacturability and yield requirements
  
  

Core Responsibilities

IC Design Execution & Delivery

• Lead all IC development across:
• Analog design
• Digital design
• Mixed-signal integration
• Design verification
• CAD/Layout
• Design reuse
• Ensure high-quality execution from specification through tape-out and silicon validation.
• Deliver designs that meet schedule, performance, cost, and quality targets.
  
  

Alignment to Product & Marketing Requirements

• Work closely with Product & Technology and Marketing to ensure clear translation of roadmap requirements into design specifications.
• Provide early input on feasibility, risk, and trade-offs.
• Maintain alignment between architecture intent and silicon implementation.
  
  

Design Methodology & Productivity

• Establish best-in-class design methodologies, tools, and flows.
• Drive improvements in:
• Design reuse
• Verification coverage
• Silicon iterations
• Time-to-functioning silicon
• Build scalable design infrastructure to support future growth.
  
  

Cross-Functional Integration

• Partner closely with:
• Product & Technology (architecture and requirements)
• Marketing (roadmap alignment)
• Operations (process, yield, cost, backend execution)
• Business Units (application needs and priorities)
• Ensure tight alignment between design, manufacturing, and system requirements.
  
  

Risk Management & Predictable Execution

• Implement disciplined design and verification processes to reduce execution risk.
• Identify and manage technical risks early in the development cycle.
• Ensure high confidence in tape-out schedules and silicon success.
• Drive a culture of accountability and delivery predictability.
  
  

Organizational Leadership

• Lead global IC design teams across regions.
• Build a strong technical culture focused on:
• Quality
• Execution discipline
• Risk management
• Design reuse
• Continuous improvement
• Recruit, develop, and retain top engineering talent.
  
  

Ideal Profile

• 15+ years of experience in IC design (analog, mixed-signal, or power ICs).
• Proven leadership of global IC design teams.
• Deep expertise in:
• High-voltage / power IC design
• Mixed-signal integration
• Semiconductor processes (BCD, HV, GaN preferred)
• Strong track record of delivering silicon on schedule with high quality.
• Experience improving design productivity and execution predictability.
• Strong cross-functional collaboration skills across product, marketing, and operations.