A globally successful, high-scale Semiconductor & Connectivity startup that engineers next-generation, high-speed communication chips tailored for massive hyperscale data centers.
Their disruptive silicon architectures eliminate bandwidth bottlenecks, driving ultra-low latency and massive throughput for global cloud-computing infrastructures.
Located in the Center region (exceptionally accessible, situated directly on a primary train line) and operating on a hybrid model with two days of remote work per week.
Position Overview-
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Principal / Senior System Hardware Engineer taking technical ownership over the end-to-end design, simulation, and validation of complex, high-speed multi-layer PCBs.
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Designing robust hardware topologies to meet elite performance, thermal, and signal reliability benchmarks under extreme physical operating conditions.
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Performing advanced multi-physics, electromagnetic, and power simulations to validate high-frequency serial links and interconnects.
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Collaborating cross-functionally with core Firmware, Embedded Software, and Mechanical Engineering divisions to align physical layouts with system specifications.
Requirements-
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B.Sc. in Electrical Engineering, Electronics Engineering, or a related academic discipline - Mandatory
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10 years of proven professional experience specializing in high-speed digital board design and/or RF circuit layout - Mandatory
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Hands-on, expert-level proficiency with SI/PI simulation workflows and RF/EM simulation tools (e.g., HFSS, CST) - Mandatory
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Deep theoretical and practical mastery of high-speed serial interfaces, high-fidelity clock distribution systems, and robust Power Delivery Networks (PDN) - Mandatory
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Extensive knowledge of EMI/EMC mitigation methodologies, shielding practices, and advanced board bring-up/debugging techniques - Mandatory
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Proficiency with professional EDA tools for schematics and layout design (e.g., OrCAD, Allegro) - Mandatory