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Embedded Systems Engineer
CIM MCU/SoC Application Engineer
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Winbond
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CIM MCU/SoC Application Engineer
Winbond
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📍 Hsinchu City, Taiwan 🇹🇼
full-time
mid-level
Expired
Posted —
This job posting has expired
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Key Skills
CIM
SoC
FPGA
PDK
MCU
Industry
Semiconductor
Consumer Electronics
Job Description
【工作內容】
作為華邦的(竹北) CIM MCU/SoC Application Engineer,
Develop the application environment for the CIM MCU/SoC. 2. Build proofs of concept (PoCs) on the CIM MCU/SoC solutions. 3. Lead FPGA- and PDK-based development.
【工作地點】 竹北辦公室(新竹縣竹北市文興路二段539號)
【條件要求】
學歷要求:碩士
科系要求:電機電子工程相關 │ │
相關經驗:5年以上
語言能力:英文 高級 │ │
管理責任:No
輪班需求:No
出差需求:無
外派需求:No
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Hsinchu City, Taiwan
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