📍 Rüti ZH, Zürich
PackSys Global manufactures machinery for the packaging industry, specializing in high-speed packaging solutions. The company is headquartered in Switzerland and serves various markets, including food and beverage, pharmaceuticals, and consumer goods. Engineering at PackSys Global focuses on mechanical design, automation, and control systems. Engineers work on developing efficient packaging machines that integrate advanced technologies for improved production rates. Specific details about headcount or notable projects are not publicly available.
Hardware Engineer
@ PackSys Global
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PackSys Global manufactures machinery for the packaging industry, specializing in high-speed packaging solutions. The company is headquartered in Switzerland and serves various markets, including food and beverage, pharmaceuticals, and consumer goods. Engineering at PackSys Global focuses on mechanical design, automation, and control systems. Engineers work on developing efficient packaging machines that integrate advanced technologies for improved production rates. Specific details about headcount or notable projects are not publicly available.
PackSys Global currently has 1 active embedded systems position in 1 location. All positions are on-site, typical for hardware-focused roles requiring lab access and equipment. Recognized as a top-tier employer (80.0/100), PackSys Global offers competitive compensation and strong career development paths in embedded engineering.
* Data represents job posting activity over the past 6 months: Jan 2026 through Jun 2026
Hiring momentum at PackSys Global is currently increasing, with 1
opening posted this month compared to 0 last month.
This upward trend often signals product development acceleration, team scaling, or new project initiatives.
Over the past 6 months, PackSys Global averaged 0.2 job postings per month,
with peak hiring in Jun 2026 (1 openings).
For embedded systems roles, hiring activity typically correlates with product development cycles,
especially for firmware teams during pre-production phases and hardware engineers during prototyping.
📈 New hiring activity
Consistent hiring velocity
Jun 2026
EPLAN is the most in-demand skill at PackSys Global,
appearing in 100% of current job listings.
This universal requirement indicates EPLAN forms the core of PackSys Global's
technical stack across all engineering teams.
PackSys Global's technology stack spans 5 distinct skills and tools,
reflecting the multifaceted nature of embedded systems development.
The focused skill requirements suggest specialized work in specific embedded domains.
PackSys Global is currently hiring for a focused Electrical Engineer position, likely to address a specific technical gap or project need.
Experience level distribution: 100% of openings target mid-level-level engineers.
PackSys Global's engineering operations are concentrated in a single country across 1 location. A single-location focus enables tight team collaboration and simplified operations, particularly valuable for hardware-intensive development requiring shared lab facilities.
These employers share technical focus areas with PackSys Global and are actively hiring embedded engineers. Exploring multiple companies helps candidates understand market compensation, compare technical challenges, and identify the best cultural and technical fit for their career goals.
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