📍 Neuhausen auf den Fildern, Baden-Württemberg
Balluff EMEA develops sensors, identification systems, and networking solutions for industrial automation. Headquartered in Neuhausen auf den Fildern, Germany, the company focuses on providing reliable data transmission and processing in manufacturing environments. Engineering disciplines include embedded software development and FPGA design, addressing challenges in real-time data processing and system integration. Balluff's expertise in sensor technology and automation solutions positions it as a key player in the industrial sector, although specific product details and employee count are not publicly available.
Senior FPGA Entwickler m|w|d
@ Balluff EMEA
FPGA und Embedded Software Entwickler m|w|d
@ Balluff EMEA
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Balluff EMEA develops sensors, identification systems, and networking solutions for industrial automation. Headquartered in Neuhausen auf den Fildern, Germany, the company focuses on providing reliable data transmission and processing in manufacturing environments. Engineering disciplines include embedded software development and FPGA design, addressing challenges in real-time data processing and system integration. Balluff's expertise in sensor technology and automation solutions positions it as a key player in the industrial sector, although specific product details and employee count are not publicly available.
Balluff EMEA currently has 1 active embedded systems position in 1 location. All positions are on-site, typical for hardware-focused roles requiring lab access and equipment. Recognized as a top-tier employer (85.0/100), Balluff EMEA offers competitive compensation and strong career development paths in embedded engineering.
* Data represents job posting activity over the past 6 months: Jan 2026 through Jun 2026
Hiring momentum at Balluff EMEA is currently increasing, with 1
opening posted this month compared to 0 last month.
This upward trend often signals product development acceleration, team scaling, or new project initiatives.
Over the past 6 months, Balluff EMEA averaged 0.2 job postings per month,
with peak hiring in Jun 2026 (1 openings).
For embedded systems roles, hiring activity typically correlates with product development cycles,
especially for firmware teams during pre-production phases and hardware engineers during prototyping.
📈 New hiring activity
Consistent hiring velocity
Jun 2026
FPGA is the most in-demand skill at Balluff EMEA,
appearing in 100% of all job listings (past and present).
This universal requirement indicates FPGA forms the core of Balluff EMEA's
technical stack across all engineering teams.
Balluff EMEA's technology stack spans 7 distinct skills and tools,
reflecting the multifaceted nature of embedded systems development.
This moderate technology stack indicates focused but varied engineering challenges.
Engineers joining Balluff EMEA should combine depth in key areas with adaptability. The mix of hardware skills (PCB design, schematics) and firmware expertise (RTOS, embedded C) indicates full-stack embedded development where engineers work across the hardware-software boundary. Candidates with adjacent skills (version control, testing frameworks, communication protocols) typically advance faster by contributing across the development lifecycle.
Balluff EMEA is currently hiring for a focused FPGA Engineer position, likely to address a specific technical gap or project need.
Experience level distribution: 100% of openings target senior-level engineers.
Balluff EMEA's engineering operations are concentrated in a single country across 2 locations. Multiple cities within one country often reflect regional talent pools or proximity to specific industry clusters (e.g., automotive in Detroit, semiconductors in Silicon Valley).
These employers share technical focus areas with Balluff EMEA and are actively hiring embedded engineers. Exploring multiple companies helps candidates understand market compensation, compare technical challenges, and identify the best cultural and technical fit for their career goals.
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