TSMC
๐Hsinchu City, Taiwan ๐น๐ผ
โฑ๏ธ full-time
๐งโโ๏ธ mid-level
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customersโ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the worldโs largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
In R&D, Design and Technology Platform (DTP) provides differentiated and world-leading design solutions to enable the implementation of System on Chip (SoC) for leading AI/HPC, communication, automotive and IoT applications on TSMC's diverse silicon and packaging technology platform. We work with the world's leading SoC design teams and ecosystem experts to promote industry-leading process design kits (PDKs) and reusable design blocks for the semiconductor intellectual property core (IP), including standard cell libraries, embedded memory, general-purpose input/output (GPIO), simulation and interface IP, as well as electronic design automation (EDA) tools and design flows for monolithic SoCs and heterogeneous 3DICs. This allows us to accelerate the process of transforming innovation into silicon chips and creating revolutionary changes in daily life!
Job Responsibilities:
1. Design CMOS Image Sensor (CIS) & depth sensor related test chips for process development.
2. Design CIS or non-CIS test lines or test chips for process monitoring and improvement.
3. Data acquisition and analysis: CIS key performance indices and random noises characterization.
Job Qualifications:
1. Master of Science in Electrical Engineering is preferred but not required; major in Electrical Engineering or closely related fields is required.
2. Analog design skills: schematic entry, SPICE and mixed-mode simulation, layout supervision.
(1) Experience in one or more of the following designs: ADCโs, DACโs, comparators, amplifiers, regulators, LVDS.
(2) Familiar with CMOS transistor operations, devices physics, and basic semiconductor processes.
3. Experience: 1~5 years in related fields, e.g., test chips, products.
Experience in full-chip verification, custom layout, tapeout, and silicon validation.
4. Knowledge of PCB schematic and layout design for chip validation is preferred.
5. Direct experience in CMOS image sensor is highly preferred.
6. Hands-on capabilities in data acquisition, analysis, and reporting are required.
Senior Embedded Software Engineer
@ Embedd
At embedd.it, we power hardware-software integration in embedded devices. We turn fragmented semiconductor chip data into configurable digital twins, then deterministically generate code, tests, and documentation โ making integration faster, cheaper, and resilient to supply chain shocks.
Weโre looking for a true legend โ someone with abstract thinking and deep expertise in low-level software development. Youโll build vendor-agnostic tooling for MCU and peripheral integration to solve hardware-software integration once and for all. We work at the intersection of embedded systems, code generation, compilers, and machine learning. Itโs your chance to help redefine how low-level development is done.
embedd.it is a UK-based startup reinventing embedded development. Our platform transforms unstructured semiconductor data into structured digital twins, enabling automatic generation of drivers, tests, and documentation. We're building a single, traceable source of truth to make integration fast, vendor-agnostic, and future-proof.
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