Bootstrap

Applied Materials

2025 Fall Embedded Firmware Co-Op

๐Ÿ“ŒRochester, United States of America ๐Ÿ‡บ๐Ÿ‡ธ

โฑ๏ธŽ internship

๐Ÿง™โ€โ™‚๏ธ entry-level

๐Ÿ’ฐ 29

on-site

Job Description

The primary role is to design, analyze and develop embedded software for the purpose of characterizing RF power systems.

Co-op dates: 9/2/2025- 12/19/2025, On-site at our Rochester office

Requirements

  • Student must be pursuing a Bachelorโ€™s or Masterโ€™s degree program in Computer Engineering, Electrical Engineering, or a related field
  • Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale;
  • Quick learner, high degree of flexibility and problem-solving skills;
  • Experience in data collection using Matlab / Python or similar tools for analysis is highly desired.
  • Experience in C/C++ development required.
  • Experience with embedded microprocessors required (ARM processor experience preferred)
  • Experience with configuration management tools (GIT, Bitbucket) desired
  • Experience with Atlassian tools (Jira, Confluence) desired
  • Development in Linux operating system environment desired.
  • Development in a real-time operating system environment

Compensation

$29 - $37 per hour

Qualifications

Education:

Skills

Certifications:

Languages:

Years of Experience:

Work Experience:

Additional Information

Shift:

10-Day 8-Hr (United States of America)

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
Other similar jobs

C++ GPU Modelling Engineer

@ AMD, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

GPU Systems Software Engineer - Cork, Ireland

@ Qualcomm, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Embedded Software Engineer

@ Actalent, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Embedded Software Engineer

@ Abbott, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Embedded Software Engineer

@ Actalent, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Embedded Software Engineer FCS & FMS

@ Airbus, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Junior R&D Software/Firmware Engineer - C++

@ Agilent Technologies, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Embedded Software Development Engineer, Ring

@ Amazon, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Embedded Software Engineer FCS & FMS

@ Airbus, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Embedded Software Engineer II, Ring

@ Amazon, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

  • Employment

    โฑ๏ธŽ internship

  • Experience

    ๐Ÿง™โ€โ™‚๏ธ entry-level

  • Salary

    ๐Ÿ’ฐ 29

  • Working model

    on-site

  • Skills
  • Industry
  • Find similar jobs

    C++ GPU Modelling Engineer

    @ AMD, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    GPU Systems Software Engineer - Cork, Ireland

    @ Qualcomm, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Embedded Software Engineer

    @ Actalent, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Embedded Software Engineer

    @ Abbott, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Embedded Software Engineer

    @ Actalent, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Embedded Software Engineer FCS & FMS

    @ Airbus, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Junior R&D Software/Firmware Engineer - C++

    @ Agilent Technologies, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Embedded Software Development Engineer, Ring

    @ Amazon, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Embedded Software Engineer FCS & FMS

    @ Airbus, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

    Embedded Software Engineer II, Ring

    @ Amazon, ๐Ÿ“United States of America ๐Ÿ‡บ๐Ÿ‡ธ

Remote Work
Post time
Level
Employment
Industry
Apply Now โ†—